Article · Journal · 2011

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Emeka H. Amalu, W.K. Lau, Nduka Nnamdi Ekere, R.S. Bhatti, Sabuj Mallik, K.C. Otiaba and 1 more

Microelectronic Engineering

• Closed access
• International · 3 countries

Go to the publisher10.1016/j.mee.2011.02.104