Artigo · Revista · 2011

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Emeka H. Amalu, W.K. Lau, Nduka Nnamdi Ekere, R.S. Bhatti, Sabuj Mallik, K.C. Otiaba e mais 1

Microelectronic Engineering

• Acesso fechado
• Internacional · 3 países

Ir para a editora10.1016/j.mee.2011.02.104