conference paper · 2009

Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering

Peter K. Bernasko, Sabuj Mallik, Nduka Nnamdi Ekere, Anasyida Abu Seman, Gabriel Takyi

• Accès fermé
• International · 2 pays

Aller chez l’éditeur10.1109/eptc.2009.5416398