Article · Journal · 2026

Rice husk ash-enhanced Sn–5.0Sb-0.7Cu (SSC507) solder: Intermetallic layer growth and diffusion behavior

T.T. Dele-Afolabi, M. Azmah Hanim, O. J. Ojo-Kupoluyi, Abdul Azeez Olayiwola Sirajudeen, Yusuf Olanrewaju Busari, A. O. Adeleke

Journal of Materials Science Materials in Electronics

• Closed access
• International · 2 countries

Go to the publisher10.1007/s10854-026-17105-2