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Material Selection for Heat Sinks in HPC Microchip-Based Circuitries · Peerford

Article · Journal · 2015

Material Selection for Heat Sinks in HPC Microchip-Based Circuitries

Kunle Joseph Akinluwade, F. Omole, Dayo Adeyemi Isadare, Olanrewaju S. Adesina, A. Adetunji

British Journal of Applied Science & Technology

Closed access

Go to the publisher 10.9734/bjast/2015/15214

Citations: 14from other works
Field-weighted impact: 0.161.00 is the world average for its field and year
Among its field: 52nd percentileby citations, against works of its field and year
Authors: 5from 3 institutions

Authors

5 authors across 3 institutions in 1 country

Kunle Joseph AkinluwadeFirst author
- African Institute of Science and Technology (NG)
as printed: Kunle Akinluwade
F. Omole
- National Agency for Science and Engineering Infrastructure (NG)
Dayo Adeyemi Isadare
- African Institute of Science and Technology (NG)
as printed: D. Isadare
Olanrewaju S. Adesina
- National Agency for Science and Engineering Infrastructure (NG)
as printed: O. Adesina
A. AdetunjiSenior author

Obafemi Awolowo University (NG)

National Agency for Science and Engineering Infrastructure (NG)

Development goals

7Affordable and clean energy

Country

Nigeria

Fields

A work can sit in several, each with a score

Advanced Sensor and Energy Harvesting MaterialsTopic
Electronic Packaging and Soldering TechnologiesTopic
Adhesion, Friction, and Surface InteractionsTopic