conference paper · Publicação · 2011

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

Emeka H. Amalu, Y. T. Lui, Nduka Nnamdi Ekere, R.S. Bhatti, Gabriel Takyi, Francisco Chinesta e mais 2

AIP conference proceedings

• Acesso fechado
• Internacional · 3 países

Ir para a editora10.1063/1.3552519