Article · Revue · 2011

Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion

Emeka H. Amalu, Nduka Nnamdi Ekere, R.S. Bhatti, Sabuj Mallik, Gabriel Takyi, Akii Ibhadode

Advanced materials research

• Accès ouvert · Hybride
• International · 3 pays

Le lire10.4028/www.scientific.net/amr.367.287